Chip maker Intel has detailed an ambitious architecture roadmap, showcasing a series of foundational innovations that will power products through 2025 and beyond.
Chip maker ans the tech-giant Intel elaborated on the road map, showing a series of new features that will help products by 2025 and beyond, with the aim of leading the processor space as well.
The company on Monday unveiled the technology for two successful processes: RibbonFET, the new Intel transistor in more than a decade, and PowerVia, the first rear power delivery industry.
"In addition to Intel's unquestionable leadership in high-end packaging, we are accelerating our new approach to ensuring we are on a clear path to processing operational leadership by 2025," Intel chief executive Pat Gelsinger said during a global Intel "Accelerated" broadcast.
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"We are using our unparalleled innovation pipeline to bring technological advances from the transistor to the system level. Until the end of the periodic table, we will continue to follow Moore's law and our silicon magic design," he added.
Intel 7 brings about a 10 to 15 percent increase in watt increase compared to the Intel 10nm SuperFin, based on the FinFET transistor configuration.
Intel 7 will be introduced in products such as the Alder Lake client in 2021 and Sapphire Rapids data center, which is expected to be in production in the first quarter of 2022, the company said.
"The innovations introduced today will not only allow Intel's product path; they will be even more important to our customers," Gelsinger said.
Intel 4 fully embraces EUV lithography to print surprisingly small features using ultra-short wavelength light.
With almost 20 percent watts of performance-per-watt, as well as space improvements, the Intel 4 will be ready for production in the second half of 2022 of 2023 exports.
Intel 3 will be ready to start manufacturing products in the second half of 2023.
Intel 20A is entering the Angstrom era with two explosive technologies, RibbonFET and PowerVia, the company said.
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